Product

CIRCUIT BOARD ENGRAVING MACHINE

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CIRCUIT BOARD ENGRAVING MACHINE

Technical Parameter The finest processing conductor width/spacing: approx.0.1mm(4mil) Processing minimum hole diameter : 0.2mm (8mil) Processing format : approx. 305mmx 230mm Using Germany high-speed electric spindle with speed : approx.60000rpm Repeat positioning accuracy :≤±5μm System positioning accuracy :≤±20μm Contour through the milling speed :approx. 6mm/s